Paul Conway
About
Paul Conway has authored 219 papers that have received a total of 2.6k indexed citations.
This includes 90 papers in Electrical and Electronic Engineering, 50 papers in Mechanical Engineering and 37 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (59 papers), 3D IC and TSV technologies (48 papers) and Digital and Traditional Archives Management (20 papers). Paul Conway is often cited by papers focused on Electronic Packaging and Soldering Technologies (59 papers), 3D IC and TSV technologies (48 papers) and Digital and Traditional Archives Management (20 papers) and collaborates with scholars based in United Kingdom, United States and China. Paul Conway's co-authors include Andrew West, Changqing Liu, David A. Hutt, Sian Slawson and Zhiheng Huang and has published in prestigious journals such as Journal of The Electrochemical Society, Acta Materialia and Journal of Cleaner Production
In The Last Decade
Explore authors with similar magnitude of impact
Top fields papers by Yuan Gao are about Top fields papers by Gianfranco Damiani are about Top journals papers by Heng Liu are published in Top fields papers by Vern L. Bullough are about Top countries impacted by papers by J.G. González-Rodrı́guez Top journals papers by Lawrence K. Forbes are published in Top countries impacted by papers by Chengyu Zhang Top authors papers by Ki–Nam Shim are co-authored with