Changqing Liu
About
Changqing Liu has authored 140 papers that have received a total of 2.0k indexed citations.
This includes 103 papers in Electrical and Electronic Engineering, 64 papers in Mechanical Engineering and 26 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (68 papers), 3D IC and TSV technologies (35 papers) and Aluminum Alloys Composites Properties (22 papers). Changqing Liu is often cited by papers focused on Electronic Packaging and Soldering Technologies (68 papers), 3D IC and TSV technologies (35 papers) and Aluminum Alloys Composites Properties (22 papers) and collaborates with scholars based in United Kingdom, China and Hong Kong. Changqing Liu's co-authors include Vadim V. Silberschmidt, Paul Conway, Fengshun Wu, Guang Yang and Zhiwen Chen and has published in prestigious journals such as Applied Physics Letters, Langmuir and Journal of The Electrochemical Society
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