Zhiwen Chen
About
Zhiwen Chen has authored 46 papers that have received a total of 555 indexed citations.
This includes 33 papers in Electrical and Electronic Engineering, 23 papers in Mechanical Engineering and 9 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (24 papers), 3D IC and TSV technologies (11 papers) and Aluminum Alloys Composites Properties (10 papers). Zhiwen Chen is often cited by papers focused on Electronic Packaging and Soldering Technologies (24 papers), 3D IC and TSV technologies (11 papers) and Aluminum Alloys Composites Properties (10 papers) and collaborates with scholars based in China, United Kingdom and Australia. Zhiwen Chen's co-authors include Changqing Liu, Li Liu, Xueqiang Cao, Yiping Wu and Bing An and has published in prestigious journals such as Nature Communications, Journal of Power Sources and Journal of Cleaner Production
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