Yiping Wu

54 papers and 576 indexed citations i.

Yiping Wu has authored 54 papers that have received a total of 576 indexed citations. This includes 39 papers in Electrical and Electronic Engineering, 24 papers in Mechanical Engineering and 14 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (15 papers) and Advanced Welding Techniques Analysis (10 papers). Yiping Wu is often cited by papers focused on Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (15 papers) and Advanced Welding Techniques Analysis (10 papers) and collaborates with scholars based in China, United Kingdom and Hong Kong. Yiping Wu's co-authors include Bing An, Changsheng Xie, Liang Chen, Zhiwen Chen and Fengshun Wu and has published in prestigious journals such as Optics Letters, Sensors and Journal of Alloys and Compounds