Zhiheng Huang
About
Zhiheng Huang has authored 54 papers that have received a total of 545 indexed citations.
This includes 37 papers in Electrical and Electronic Engineering, 20 papers in Materials Chemistry and 15 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (16 papers), 3D IC and TSV technologies (11 papers) and Aluminum Alloy Microstructure Properties (8 papers). Zhiheng Huang is often cited by papers focused on Electronic Packaging and Soldering Technologies (16 papers), 3D IC and TSV technologies (11 papers) and Aluminum Alloy Microstructure Properties (8 papers) and collaborates with scholars based in China, United Kingdom and Finland. Zhiheng Huang's co-authors include Shuanjin Wang, Yuezhong Meng, Min Xiao, Dongmei Han and Paul Conway and has published in prestigious journals such as Science, Advanced Materials and Nature Materials
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