D.F. Baldwin

31 papers and 450 indexed citations i.

D.F. Baldwin has authored 31 papers that have received a total of 450 indexed citations. This includes 28 papers in Electrical and Electronic Engineering, 8 papers in Mechanics of Materials and 4 papers in Mechanical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (23 papers), 3D IC and TSV technologies (22 papers) and Advanced MEMS and NEMS Technologies (4 papers). D.F. Baldwin is often cited by papers focused on Electronic Packaging and Soldering Technologies (23 papers), 3D IC and TSV technologies (22 papers) and Advanced MEMS and NEMS Technologies (4 papers) and collaborates with scholars based in United States, Japan and Germany. D.F. Baldwin's co-authors include C.P. Wong, Chun‐Ho Kim, Derek J. Milner, Rao Tummala and Brian Smith and has published in prestigious journals such as Applied Energy, IEEE Transactions on Robotics and Automation and Polymer Engineering and Science