Di Xu
About
Di Xu has authored 36 papers that have received a total of 771 indexed citations.
This includes 20 papers in Electrical and Electronic Engineering, 16 papers in Materials Chemistry and 8 papers in Polymers and Plastics. The topics of these papers are Electronic Packaging and Soldering Technologies (8 papers), Copper Interconnects and Reliability (6 papers) and Microstructure and mechanical properties (6 papers). Di Xu is often cited by papers focused on Electronic Packaging and Soldering Technologies (8 papers), Copper Interconnects and Reliability (6 papers) and Microstructure and mechanical properties (6 papers) and collaborates with scholars based in China, United States and Canada. Di Xu's co-authors include M. Mayer, Junjie Xie, Tao Zhang, Jae Pil Jung and Dilip Gersappe and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Macromolecules
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