D.J. Williams
About
D.J. Williams has authored 23 papers that have received a total of 439 indexed citations.
This includes 14 papers in Electrical and Electronic Engineering, 7 papers in Materials Chemistry and 4 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (6 papers), 3D IC and TSV technologies (5 papers) and Molecular Junctions and Nanostructures (3 papers). D.J. Williams is often cited by papers focused on Electronic Packaging and Soldering Technologies (6 papers), 3D IC and TSV technologies (5 papers) and Molecular Junctions and Nanostructures (3 papers) and collaborates with scholars based in United Kingdom, United States and Trinidad and Tobago. D.J. Williams's co-authors include Paul Conway, D.C. Whalley, Alexandra M. Z. Slawin, John P. Mathias and Michael F. Froix and has published in prestigious journals such as Journal of the American Chemical Society, The Journal of Chemical Physics and Journal of Applied Physics
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