Donghua Yang

41 papers and 485 indexed citations i.

Donghua Yang has authored 41 papers that have received a total of 485 indexed citations. This includes 21 papers in Mechanical Engineering, 19 papers in Electrical and Electronic Engineering and 15 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (12 papers), Aluminum Alloys Composites Properties (9 papers) and 3D IC and TSV technologies (8 papers). Donghua Yang is often cited by papers focused on Electronic Packaging and Soldering Technologies (12 papers), Aluminum Alloys Composites Properties (9 papers) and 3D IC and TSV technologies (8 papers) and collaborates with scholars based in China, Australia and Hong Kong. Donghua Yang's co-authors include Liangliang Li, Yiping Wu, Xia An, Huimin Yang and Wenjing Zhou and has published in prestigious journals such as Acta Materialia, Journal of Colloid and Interface Science and Journal of Materials Chemistry A