Dongkai Shangguan
About
Dongkai Shangguan has authored 57 papers that have received a total of 1.2k indexed citations.
This includes 50 papers in Electrical and Electronic Engineering, 33 papers in Mechanical Engineering and 13 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (47 papers), 3D IC and TSV technologies (29 papers) and Advanced Welding Techniques Analysis (14 papers). Dongkai Shangguan is often cited by papers focused on Electronic Packaging and Soldering Technologies (47 papers), 3D IC and TSV technologies (29 papers) and Advanced Welding Techniques Analysis (14 papers) and collaborates with scholars based in United States, China and Finland. Dongkai Shangguan's co-authors include David Geiger, Johan Liu, Walter Dauksher, Xicheng Wei and Bob Sullivan and has published in prestigious journals such as Journal of Alloys and Compounds, International Journal of Solids and Structures and Metallurgical and Materials Transactions A
In The Last Decade
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