Walter Dauksher

21 papers and 270 indexed citations i.

Walter Dauksher has authored 21 papers that have received a total of 270 indexed citations. This includes 20 papers in Electrical and Electronic Engineering, 7 papers in Mechanical Engineering and 7 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (10 papers) and Electromagnetic Simulation and Numerical Methods (4 papers). Walter Dauksher is often cited by papers focused on Electronic Packaging and Soldering Technologies (13 papers), 3D IC and TSV technologies (10 papers) and Electromagnetic Simulation and Numerical Methods (4 papers) and collaborates with scholars based in United States, Canada and Hong Kong. Walter Dauksher's co-authors include John H. Lau, Bob Sullivan, Dongkai Shangguan, A. F. Emery and V. Schroeder and has published in prestigious journals such as Computer Methods in Applied Mechanics and Engineering, International Journal for Numerical Methods in Engineering and Microelectronics Reliability