Douglas Yu

18 papers and 172 indexed citations i.

Douglas Yu has authored 18 papers that have received a total of 172 indexed citations. This includes 17 papers in Electrical and Electronic Engineering, 4 papers in Hardware and Architecture and 3 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are 3D IC and TSV technologies (11 papers), Semiconductor materials and devices (6 papers) and Electronic Packaging and Soldering Technologies (4 papers). Douglas Yu is often cited by papers focused on 3D IC and TSV technologies (11 papers), Semiconductor materials and devices (6 papers) and Electronic Packaging and Soldering Technologies (4 papers) and collaborates with scholars based in Taiwan and United States. Douglas Yu's co-authors include W.C. Chiou, Jean Wang, K. C. Ting, Duane S. Boning and Cheng‐Hsien Wu and has published in prestigious journals such as IEEE Transactions on Electron Devices