K. C. Ting

4 papers and 81 indexed citations i.

K. C. Ting has authored 4 papers that have received a total of 81 indexed citations. This includes 3 papers in Electrical and Electronic Engineering, 1 paper in Biomedical Engineering and 1 paper in Atomic and Molecular Physics, and Optics. The topics of these papers are 3D IC and TSV technologies (3 papers), Electronic Packaging and Soldering Technologies (2 papers) and Integrated Circuits and Semiconductor Failure Analysis (2 papers). K. C. Ting is often cited by papers focused on 3D IC and TSV technologies (3 papers), Electronic Packaging and Soldering Technologies (2 papers) and Integrated Circuits and Semiconductor Failure Analysis (2 papers) and collaborates with scholars based in Taiwan, China and Australia. K. C. Ting's co-authors include S. Y. Hou, Cheng‐Hsien Wu, W.C. Chiou, Douglas Yu and Tianjun Yu and has published in prestigious journals such as Biosensors and Bioelectronics and IEEE Transactions on Electron Devices