S. Y. Hou

7 papers and 90 indexed citations i.

S. Y. Hou has authored 7 papers that have received a total of 90 indexed citations. This includes 7 papers in Electrical and Electronic Engineering, 2 papers in Atomic and Molecular Physics, and Optics and 1 paper in Biomedical Engineering. The topics of these papers are 3D IC and TSV technologies (5 papers), Integrated Circuits and Semiconductor Failure Analysis (3 papers) and Electronic Packaging and Soldering Technologies (2 papers). S. Y. Hou is often cited by papers focused on 3D IC and TSV technologies (5 papers), Integrated Circuits and Semiconductor Failure Analysis (3 papers) and Electronic Packaging and Soldering Technologies (2 papers) and collaborates with scholars based in Taiwan, China and United States. S. Y. Hou's co-authors include K. C. Ting, Cheng‐Hsien Wu, W.C. Chiou, Douglas Yu and Tianjun Yu and has published in prestigious journals such as IEEE Transactions on Wireless Communications and IEEE Transactions on Electron Devices