Duane S. Boning
About
Duane S. Boning has authored 157 papers that have received a total of 1.8k indexed citations.
This includes 102 papers in Electrical and Electronic Engineering, 61 papers in Biomedical Engineering and 28 papers in Mechanical Engineering. The topics of these papers are Chemical Mechanical Polishing in Microelectronics Manufacturing (44 papers), Integrated Circuits and Semiconductor Failure Analysis (23 papers) and Advancements in Photolithography Techniques (19 papers). Duane S. Boning is often cited by papers focused on Chemical Mechanical Polishing in Microelectronics Manufacturing (44 papers), Integrated Circuits and Semiconductor Failure Analysis (23 papers) and Advancements in Photolithography Techniques (19 papers) and collaborates with scholars based in United States, Singapore and Iran. Duane S. Boning's co-authors include Hayden Taylor, J.E. Chung, B.E. Stine, Brian Lee and T. Smith and has published in prestigious journals such as Applied Physics Letters, Journal of The Electrochemical Society and Optics Express
In The Last Decade
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