E. Jung
About
E. Jung has authored 35 papers that have received a total of 447 indexed citations.
This includes 22 papers in Electrical and Electronic Engineering, 13 papers in Biomedical Engineering and 5 papers in Cellular and Molecular Neuroscience. The topics of these papers are 3D IC and TSV technologies (12 papers), Electronic Packaging and Soldering Technologies (7 papers) and Microfluidic and Bio-sensing Technologies (6 papers). E. Jung is often cited by papers focused on 3D IC and TSV technologies (12 papers), Electronic Packaging and Soldering Technologies (7 papers) and Microfluidic and Bio-sensing Technologies (6 papers) and collaborates with scholars based in Germany, Italy and United Kingdom. E. Jung's co-authors include Tanja Braun, R. Guerrieri, H. Reichl, R. Aschenbrenner and Roberto Gambari and has published in prestigious journals such as Nature Communications, Biomaterials and Optics Express
In The Last Decade
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