E. Pek

3 papers and 158 indexed citations i.

E. Pek has authored 3 papers that have received a total of 158 indexed citations. This includes 3 papers in Electrical and Electronic Engineering, 0 papers in Industrial relations and 0 papers in Molecular Biology. The topics of these papers are 3D IC and TSV technologies (3 papers), Electrostatic Discharge in Electronics (3 papers) and Electronic Packaging and Soldering Technologies (3 papers). E. Pek is often cited by papers focused on 3D IC and TSV technologies (3 papers), Electrostatic Discharge in Electronics (3 papers) and Electronic Packaging and Soldering Technologies (3 papers) and collaborates with scholars based in Singapore, United States and Switzerland. E. Pek's co-authors include Chwee Teck Lim, Z.W. Zhong, Tong Yan Tee, Jing-en Luan and Jiang Zhou and has published in prestigious journals such as Microelectronics Reliability and IEEE Transactions on Components and Packaging Technologies