Tong Yan Tee

21 papers and 405 indexed citations i.

Tong Yan Tee has authored 21 papers that have received a total of 405 indexed citations. This includes 21 papers in Electrical and Electronic Engineering, 7 papers in Mechanical Engineering and 3 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (20 papers), 3D IC and TSV technologies (16 papers) and Integrated Circuits and Semiconductor Failure Analysis (4 papers). Tong Yan Tee is often cited by papers focused on Electronic Packaging and Soldering Technologies (20 papers), 3D IC and TSV technologies (16 papers) and Integrated Circuits and Semiconductor Failure Analysis (4 papers) and collaborates with scholars based in Singapore, United States and Switzerland. Tong Yan Tee's co-authors include Z.W. Zhong, Hun Shen Ng, Jiang Zhou, E. Pek and Chwee Teck Lim and has published in prestigious journals such as Proceedings of the IEEE, Thin Solid Films and Journal of Electronic Materials