E Perfecto
About
E Perfecto has authored 11 papers that have received a total of 54 indexed citations.
This includes 11 papers in Electrical and Electronic Engineering, 3 papers in Electronic, Optical and Magnetic Materials and 1 paper in Automotive Engineering. The topics of these papers are 3D IC and TSV technologies (10 papers), Electronic Packaging and Soldering Technologies (8 papers) and Copper Interconnects and Reliability (3 papers). E Perfecto is often cited by papers focused on 3D IC and TSV technologies (10 papers), Electronic Packaging and Soldering Technologies (8 papers) and Copper Interconnects and Reliability (3 papers) and collaborates with scholars based in United States. E Perfecto's co-authors include K. Prasad, Anupam Giri, A. Deutsch, G. Edward White and L. Shi and has published in prestigious journals such as IBM Journal of Research and Development, IEEE Transactions on Advanced Packaging and IEEE Transactions on Components Packaging and Manufacturing Technology Part B
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