E. Ristolainen

44 papers and 572 indexed citations i.

E. Ristolainen has authored 44 papers that have received a total of 572 indexed citations. This includes 35 papers in Electrical and Electronic Engineering, 12 papers in Mechanical Engineering and 9 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (23 papers), 3D IC and TSV technologies (23 papers) and Microstructure and mechanical properties (7 papers). E. Ristolainen is often cited by papers focused on Electronic Packaging and Soldering Technologies (23 papers), 3D IC and TSV technologies (23 papers) and Microstructure and mechanical properties (7 papers) and collaborates with scholars based in Finland and United States. E. Ristolainen's co-authors include T. Lepistö, Pekka Heino, Dongkai Shangguan, Paul H. Holloway and K. Saarinen and has published in prestigious journals such as Materials Science and Engineering A, Applied Surface Science and IEEE Transactions on Microwave Theory and Techniques.