Eric Kuah
About
Eric Kuah has authored 3 papers that have received a total of 33 indexed citations.
This includes 3 papers in Electrical and Electronic Engineering, 2 papers in Electronic, Optical and Magnetic Materials and 1 paper in Biomedical Engineering. The topics of these papers are 3D IC and TSV technologies (3 papers), Electronic Packaging and Soldering Technologies (3 papers) and Copper Interconnects and Reliability (2 papers). Eric Kuah is often cited by papers focused on 3D IC and TSV technologies (3 papers), Electronic Packaging and Soldering Technologies (3 papers) and Copper Interconnects and Reliability (2 papers) and collaborates with scholars based in India, China and France. Eric Kuah's co-authors include Kai Wu, John H. Lau, K. H. Tan, Nelson Fan and Dong Chen and has published in prestigious journals such as IEEE Transactions on Components Packaging and Manufacturing Technology
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