Nelson Fan

7 papers and 80 indexed citations i.

Nelson Fan has authored 7 papers that have received a total of 80 indexed citations. This includes 6 papers in Electrical and Electronic Engineering, 2 papers in Biomedical Engineering and 2 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (5 papers), 3D IC and TSV technologies (5 papers) and Material Properties and Processing (2 papers). Nelson Fan is often cited by papers focused on Electronic Packaging and Soldering Technologies (5 papers), 3D IC and TSV technologies (5 papers) and Material Properties and Processing (2 papers) and collaborates with scholars based in United States, India and China. Nelson Fan's co-authors include Kai Wu, John H. Lau, Eric Kuah, Ming Li and K. H. Tan and has published in prestigious journals such as Journal of Electronic Packaging and IEEE Transactions on Components Packaging and Manufacturing Technology