Eugene J. Rymaszewski

29 papers and 1.3k indexed citations i.

About

Eugene J. Rymaszewski has authored 29 papers that have received a total of 1.3k indexed citations. This includes 26 papers in Electrical and Electronic Engineering, 12 papers in Materials Chemistry and 11 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Semiconductor materials and devices (19 papers), Copper Interconnects and Reliability (11 papers) and Metal and Thin Film Mechanics (9 papers). Eugene J. Rymaszewski is often cited by papers focused on Semiconductor materials and devices (19 papers), Copper Interconnects and Reliability (11 papers) and Metal and Thin Film Mechanics (9 papers) and collaborates with scholars based in United States, India and Sweden. Eugene J. Rymaszewski's co-authors include Toh‐Ming Lu, T.‐M. Lu, D. B. Knorr, J.M. Borrego and Rao Tummala and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and IEEE Transactions on Power Electronics.

In The Last Decade

Fields of papers published by Eugene J. Rymaszewski

Since Specialization
EngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics

Countries citing papers authored by Eugene J. Rymaszewski

Since Specialization
Citations
Rankless by CCL
2025