Fay Hua

15 papers and 404 indexed citations i.

Fay Hua has authored 15 papers that have received a total of 404 indexed citations. This includes 8 papers in Electrical and Electronic Engineering, 6 papers in Mechanical Engineering and 4 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (5 papers) and nanoparticles nucleation surface interactions (4 papers). Fay Hua is often cited by papers focused on Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (5 papers) and nanoparticles nucleation surface interactions (4 papers) and collaborates with scholars based in United States, United Kingdom and China. Fay Hua's co-authors include J. W. Morris, Kyoung‐sik Moon, Hongjin Jiang, Fu Guo and R. N. Grugel and has published in prestigious journals such as Journal of Applied Physics, Chemistry of Materials and Chemical Physics Letters