Fenglian Sun

76 papers and 1.1k indexed citations i.

Fenglian Sun has authored 76 papers that have received a total of 1.1k indexed citations. This includes 72 papers in Electrical and Electronic Engineering, 53 papers in Mechanical Engineering and 7 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (61 papers), 3D IC and TSV technologies (48 papers) and Aluminum Alloys Composites Properties (21 papers). Fenglian Sun is often cited by papers focused on Electronic Packaging and Soldering Technologies (61 papers), 3D IC and TSV technologies (48 papers) and Aluminum Alloys Composites Properties (21 papers) and collaborates with scholars based in China, The Netherlands and United States. Fenglian Sun's co-authors include Guoqi Zhang, Zuozhu Yin and Xuemei Li and has published in prestigious journals such as ACS Nano, Chemical Engineering Journal and Nanotechnology