Fengmei Liu
About
Fengmei Liu has authored 44 papers that have received a total of 320 indexed citations.
This includes 23 papers in Electrical and Electronic Engineering, 17 papers in Mechanical Engineering and 10 papers in Artificial Intelligence. The topics of these papers are Intermetallics and Advanced Alloy Properties (10 papers), High Temperature Alloys and Creep (8 papers) and Electronic Packaging and Soldering Technologies (6 papers). Fengmei Liu is often cited by papers focused on Intermetallics and Advanced Alloy Properties (10 papers), High Temperature Alloys and Creep (8 papers) and Electronic Packaging and Soldering Technologies (6 papers) and collaborates with scholars based in China, United States and Japan. Fengmei Liu's co-authors include Yanchen Qu, Yaoyong Yi, Hongbo Qin, Xiaoyong Hu and Jinlong Yang and has published in prestigious journals such as Journal of Colloid and Interface Science, IEEE Transactions on Information Theory and Molecules
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