Hongbo Qin

34 papers and 445 indexed citations i.

Hongbo Qin has authored 34 papers that have received a total of 445 indexed citations. This includes 25 papers in Mechanical Engineering, 22 papers in Electrical and Electronic Engineering and 16 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (18 papers), Aluminum Alloys Composites Properties (13 papers) and Intermetallics and Advanced Alloy Properties (10 papers). Hongbo Qin is often cited by papers focused on Electronic Packaging and Soldering Technologies (18 papers), Aluminum Alloys Composites Properties (13 papers) and Intermetallics and Advanced Alloy Properties (10 papers) and collaborates with scholars based in China, The Netherlands and Japan. Hongbo Qin's co-authors include Daoguo Yang, Guoqi Zhang, Fengmei Liu, Yaoyong Yi and Tianhan Liu and has published in prestigious journals such as Chemical Physics Letters, Small and Journal of Alloys and Compounds