Fengshun Wu

61 papers and 853 indexed citations i.

Fengshun Wu has authored 61 papers that have received a total of 853 indexed citations. This includes 47 papers in Electrical and Electronic Engineering, 36 papers in Mechanical Engineering and 11 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (42 papers), 3D IC and TSV technologies (22 papers) and Aluminum Alloys Composites Properties (19 papers). Fengshun Wu is often cited by papers focused on Electronic Packaging and Soldering Technologies (42 papers), 3D IC and TSV technologies (22 papers) and Aluminum Alloys Composites Properties (19 papers) and collaborates with scholars based in China, Hong Kong and United Kingdom. Fengshun Wu's co-authors include Changqing Liu, Y.C. Chan, Guang Chen, Huayu Sun and Vadim V. Silberschmidt and has published in prestigious journals such as Journal of Power Sources, Scientific Reports and Journal of Materials Chemistry A