Fengze Hou

26 papers and 308 indexed citations i.

Fengze Hou has authored 26 papers that have received a total of 308 indexed citations. This includes 20 papers in Electrical and Electronic Engineering, 16 papers in Mechanical Engineering and 2 papers in Automotive Engineering. The topics of these papers are 3D IC and TSV technologies (9 papers), Heat Transfer and Optimization (9 papers) and Electromagnetic Compatibility and Noise Suppression (8 papers). Fengze Hou is often cited by papers focused on 3D IC and TSV technologies (9 papers), Heat Transfer and Optimization (9 papers) and Electromagnetic Compatibility and Noise Suppression (8 papers) and collaborates with scholars based in China, The Netherlands and United States. Fengze Hou's co-authors include Liqiang Cao, Guoqi Zhang, Tingyu Lin, Chuan Chen and Meiying Su and has published in prestigious journals such as IEEE Transactions on Power Electronics, Scripta Materialia and IEEE Transactions on Electron Devices