Tingyu Lin

19 papers and 340 indexed citations i.

Tingyu Lin has authored 19 papers that have received a total of 340 indexed citations. This includes 10 papers in Mechanical Engineering, 8 papers in Electrical and Electronic Engineering and 3 papers in Mechanics of Materials. The topics of these papers are Heat Transfer and Boiling Studies (5 papers), Heat Transfer and Optimization (5 papers) and Electronic Packaging and Soldering Technologies (4 papers). Tingyu Lin is often cited by papers focused on Heat Transfer and Boiling Studies (5 papers), Heat Transfer and Optimization (5 papers) and Electronic Packaging and Soldering Technologies (4 papers) and collaborates with scholars based in China, United States and The Netherlands. Tingyu Lin's co-authors include Satish G. Kandlikar, Fengze Hou, Liqiang Cao, J.A. Ferreira and Meiying Su and has published in prestigious journals such as Applied Thermal Engineering, Journal of Heat Transfer and IEEE Journal of Emerging and Selected Topics in Power Electronics