Gordon Elger
About
Gordon Elger has authored 62 papers that have received a total of 607 indexed citations.
This includes 40 papers in Electrical and Electronic Engineering, 13 papers in Materials Chemistry and 10 papers in Automotive Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (23 papers), 3D IC and TSV technologies (17 papers) and GaN-based semiconductor devices and materials (9 papers). Gordon Elger is often cited by papers focused on Electronic Packaging and Soldering Technologies (23 papers), 3D IC and TSV technologies (17 papers) and GaN-based semiconductor devices and materials (9 papers) and collaborates with scholars based in Germany, Italy and United Kingdom. Gordon Elger's co-authors include Fosca Conti, Christian Endisch, Lidiya Komsiyska, H. Kurreck and Omid Mokhtari and has published in prestigious journals such as The Journal of Physical Chemistry, Physical Chemistry Chemical Physics and International Journal of Hydrogen Energy
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