Omid Mokhtari
About
Omid Mokhtari has authored 27 papers that have received a total of 578 indexed citations.
This includes 25 papers in Electrical and Electronic Engineering, 21 papers in Mechanical Engineering and 2 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (23 papers), 3D IC and TSV technologies (17 papers) and Intermetallics and Advanced Alloy Properties (10 papers). Omid Mokhtari is often cited by papers focused on Electronic Packaging and Soldering Technologies (23 papers), 3D IC and TSV technologies (17 papers) and Intermetallics and Advanced Alloy Properties (10 papers) and collaborates with scholars based in Japan, Germany and United Kingdom. Omid Mokhtari's co-authors include Hiroshi Nishikawa, S.H. Mannan, Gordon Elger, Hiren R. Kotadia and Fosca Conti and has published in prestigious journals such as Journal of Applied Physics, Materials Science and Engineering A and Journal of Alloys and Compounds
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