H. Feldis

9 papers and 86 indexed citations i.

H. Feldis has authored 9 papers that have received a total of 86 indexed citations. This includes 9 papers in Electrical and Electronic Engineering, 5 papers in Electronic, Optical and Magnetic Materials and 2 papers in Biomedical Engineering. The topics of these papers are Semiconductor materials and devices (7 papers), Copper Interconnects and Reliability (5 papers) and 3D IC and TSV technologies (3 papers). H. Feldis is often cited by papers focused on Semiconductor materials and devices (7 papers), Copper Interconnects and Reliability (5 papers) and 3D IC and TSV technologies (3 papers) and collaborates with scholars based in France, United States and Japan. H. Feldis's co-authors include M. Fayolle, C. Licitra, G. Passemard, V. Jousseaume and J. Torrès and has published in prestigious journals such as Journal of The Electrochemical Society, Journal of Vacuum Science & Technology A Vacuum Surfaces and Films and Microelectronic Engineering