H. Gan

7 papers and 320 indexed citations i.

H. Gan has authored 7 papers that have received a total of 320 indexed citations. This includes 5 papers in Electrical and Electronic Engineering, 3 papers in Electronic, Optical and Magnetic Materials and 1 paper in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (4 papers), 3D IC and TSV technologies (4 papers) and Copper Interconnects and Reliability (3 papers). H. Gan is often cited by papers focused on Electronic Packaging and Soldering Technologies (4 papers), 3D IC and TSV technologies (4 papers) and Copper Interconnects and Reliability (3 papers) and collaborates with scholars based in United States, China and Singapore. H. Gan's co-authors include K. N. Tu, K. N. Tu, Luhua Xu, S. L. Wright and John Knickerbocker and has published in prestigious journals such as Journal of Applied Physics, IEEE Journal of Solid-State Circuits and JOM