H. Reichl

151 papers and 1.9k indexed citations i.

H. Reichl has authored 151 papers that have received a total of 1.9k indexed citations. This includes 135 papers in Electrical and Electronic Engineering, 29 papers in Mechanical Engineering and 16 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (72 papers), 3D IC and TSV technologies (70 papers) and Electromagnetic Compatibility and Noise Suppression (24 papers). H. Reichl is often cited by papers focused on Electronic Packaging and Soldering Technologies (72 papers), 3D IC and TSV technologies (70 papers) and Electromagnetic Compatibility and Noise Suppression (24 papers) and collaborates with scholars based in Germany, United States and China. H. Reichl's co-authors include R. Aschenbrenner, O. Ehrmann, Stephan Guttowski, Martin Schneider‐Ramelow and Ivan Ndip and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of Power Sources