Han‐Wen Hu

51 papers and 683 indexed citations i.

Han‐Wen Hu has authored 51 papers that have received a total of 683 indexed citations. This includes 29 papers in Electrical and Electronic Engineering, 13 papers in Biomedical Engineering and 9 papers in Materials Chemistry. The topics of these papers are 3D IC and TSV technologies (18 papers), Electronic Packaging and Soldering Technologies (16 papers) and Additive Manufacturing and 3D Printing Technologies (7 papers). Han‐Wen Hu is often cited by papers focused on 3D IC and TSV technologies (18 papers), Electronic Packaging and Soldering Technologies (16 papers) and Additive Manufacturing and 3D Printing Technologies (7 papers) and collaborates with scholars based in Taiwan, China and United States. Han‐Wen Hu's co-authors include Kuan‐Neng Chen, Yang‐Fang Chen, Yu‐Ming Liao, Hung‐I Lin and Golam Haider and has published in prestigious journals such as Angewandte Chemie International Edition, Advanced Materials and Nature Communications