Heinz‐Gerd Graf
About
Heinz‐Gerd Graf has authored 16 papers that have received a total of 366 indexed citations.
This includes 15 papers in Electrical and Electronic Engineering, 4 papers in Cellular and Molecular Neuroscience and 3 papers in Aerospace Engineering. The topics of these papers are CCD and CMOS Imaging Sensors (6 papers), 3D IC and TSV technologies (5 papers) and Electronic Packaging and Soldering Technologies (5 papers). Heinz‐Gerd Graf is often cited by papers focused on CCD and CMOS Imaging Sensors (6 papers), 3D IC and TSV technologies (5 papers) and Electronic Packaging and Soldering Technologies (5 papers) and collaborates with scholars based in Germany and United States. Heinz‐Gerd Graf's co-authors include Christine Harendt, B. Höfflinger, Joachim N. Burghartz, H. Haemmerle and W. Nisch and has published in prestigious journals such as Journal of The Electrochemical Society, Sensors and IEEE Transactions on Electron Devices.
In The Last Decade
Fields of papers published by Heinz‐Gerd Graf
Since SpecializationEngineeringComputer SciencePhysics and AstronomyMathematicsEarth and Planetary SciencesEnergyEnvironmental ScienceMaterials ScienceChemical EngineeringChemistryAgricultural and Biological SciencesVeterinaryDecision SciencesArts and HumanitiesBusiness, Management and AccountingSocial SciencesPsychologyEconomics, Econometrics and FinanceHealth ProfessionsDentistryMedicineBiochemistry, Genetics and Molecular BiologyNeuroscienceNursingImmunology and MicrobiologyPharmacology, Toxicology and Pharmaceutics
Countries citing papers authored by Heinz‐Gerd Graf
Since SpecializationCitations
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