Heng-Chieh Chien
About
Heng-Chieh Chien has authored 15 papers that have received a total of 244 indexed citations.
This includes 7 papers in Electrical and Electronic Engineering, 6 papers in Materials Chemistry and 4 papers in Mechanical Engineering. The topics of these papers are 3D IC and TSV technologies (7 papers), Electronic Packaging and Soldering Technologies (5 papers) and Thermal properties of materials (5 papers). Heng-Chieh Chien is often cited by papers focused on 3D IC and TSV technologies (7 papers), Electronic Packaging and Soldering Technologies (5 papers) and Thermal properties of materials (5 papers) and collaborates with scholars based in Taiwan and United States. Heng-Chieh Chien's co-authors include Ming-Ji Dai, Wei‐Chung Lo, Ming‐Jer Kao, John H. Lau and Fang‐Lin Chao and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Physics of Fluids
In The Last Decade
Explore authors with similar magnitude of impact
Top authors papers by Nick Archer are co-authored with Top countries impacted by papers by Gholamreza Dehbozorgi Top countries impacted by papers by Jason Farman Top fields papers by D. Reymond are about Top journals papers by Enrique Bellolio are published in Top fields papers by C. Boyer are about Top authors papers by Marie‐Hélène Laverrière are co-authored with Top journals papers by Reynold Sequeira are published in