Ming-Ji Dai
About
Ming-Ji Dai has authored 12 papers that have received a total of 131 indexed citations.
This includes 9 papers in Electrical and Electronic Engineering, 4 papers in Automotive Engineering and 3 papers in Materials Chemistry. The topics of these papers are 3D IC and TSV technologies (7 papers), Electronic Packaging and Soldering Technologies (6 papers) and Additive Manufacturing and 3D Printing Technologies (4 papers). Ming-Ji Dai is often cited by papers focused on 3D IC and TSV technologies (7 papers), Electronic Packaging and Soldering Technologies (6 papers) and Additive Manufacturing and 3D Printing Technologies (4 papers) and collaborates with scholars based in Taiwan and United States. Ming-Ji Dai's co-authors include Heng-Chieh Chien, John H. Lau, Wei‐Chung Lo, Chau‐Jie Zhan and Fang‐Lin Chao and has published in prestigious journals such as Journal of Applied Physics, Computers in Biology and Medicine and Journal of Electronic Materials
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