Hideki Kitada
About
Hideki Kitada has authored 37 papers that have received a total of 278 indexed citations.
This includes 33 papers in Electrical and Electronic Engineering, 9 papers in Biomedical Engineering and 8 papers in Atomic and Molecular Physics, and Optics. The topics of these papers are 3D IC and TSV technologies (18 papers), Electronic Packaging and Soldering Technologies (15 papers) and Integrated Circuits and Semiconductor Failure Analysis (9 papers). Hideki Kitada is often cited by papers focused on 3D IC and TSV technologies (18 papers), Electronic Packaging and Soldering Technologies (15 papers) and Integrated Circuits and Semiconductor Failure Analysis (9 papers) and collaborates with scholars based in Japan. Hideki Kitada's co-authors include T. Nakamura, Takayuki Ohba, Koji Fujimoto, Hiroshi Arimoto and Akira Endoh and has published in prestigious journals such as Applied Physics Letters, Surface Science and IEEE Transactions on Electron Devices
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