Takayuki Ohba
About
Takayuki Ohba has authored 61 papers that have received a total of 709 indexed citations.
This includes 56 papers in Electrical and Electronic Engineering, 16 papers in Biomedical Engineering and 13 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are 3D IC and TSV technologies (44 papers), Electronic Packaging and Soldering Technologies (29 papers) and Semiconductor materials and devices (16 papers). Takayuki Ohba is often cited by papers focused on 3D IC and TSV technologies (44 papers), Electronic Packaging and Soldering Technologies (29 papers) and Semiconductor materials and devices (16 papers) and collaborates with scholars based in Japan, Taiwan and Israel. Takayuki Ohba's co-authors include T. Nakamura, Hideki Kitada, Koji Fujimoto, Young-Suk Kim and Toshihiko Koseki and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society
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