Hiroaki Tatsumi
About
Hiroaki Tatsumi has authored 34 papers that have received a total of 278 indexed citations.
This includes 32 papers in Electrical and Electronic Engineering, 26 papers in Mechanical Engineering and 4 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (31 papers), 3D IC and TSV technologies (20 papers) and Aluminum Alloys Composites Properties (16 papers). Hiroaki Tatsumi is often cited by papers focused on Electronic Packaging and Soldering Technologies (31 papers), 3D IC and TSV technologies (20 papers) and Aluminum Alloys Composites Properties (16 papers) and collaborates with scholars based in Japan, China and Singapore. Hiroaki Tatsumi's co-authors include Akio Hirose, Hiroshi Nishikawa, Hiroshi Yamaguchi, Tomokazu Sano and T. Matsuda and has published in prestigious journals such as Scientific Reports, Materials Science and Engineering A and Thin Solid Films
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