Hironori Tohmyoh
About
Hironori Tohmyoh has authored 102 papers that have received a total of 818 indexed citations.
This includes 52 papers in Electrical and Electronic Engineering, 38 papers in Mechanics of Materials and 37 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (25 papers), Ultrasonics and Acoustic Wave Propagation (18 papers) and Thermal properties of materials (14 papers). Hironori Tohmyoh is often cited by papers focused on Electronic Packaging and Soldering Technologies (25 papers), Ultrasonics and Acoustic Wave Propagation (18 papers) and Thermal properties of materials (14 papers) and collaborates with scholars based in Japan, China and United States. Hironori Tohmyoh's co-authors include Masumi Saka, M. Saka, Yuxin Sun, Maiko Fujimori and Yasuo OCHI and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Physical Review B
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