Masumi Saka
About
Masumi Saka has authored 131 papers that have received a total of 1.2k indexed citations.
This includes 66 papers in Electrical and Electronic Engineering, 59 papers in Mechanics of Materials and 48 papers in Mechanical Engineering. The topics of these papers are Copper Interconnects and Reliability (34 papers), Electronic Packaging and Soldering Technologies (31 papers) and Non-Destructive Testing Techniques (30 papers). Masumi Saka is often cited by papers focused on Copper Interconnects and Reliability (34 papers), Electronic Packaging and Soldering Technologies (31 papers) and Non-Destructive Testing Techniques (30 papers) and collaborates with scholars based in Japan, China and Bangladesh. Masumi Saka's co-authors include Hironori Tohmyoh, Hiroyuki Abé, Yang Ju, Yuxin Sun and Kazuhiko SASAGAWA and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of the American Ceramic Society
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