Hoe Chul Kim
About
Hoe Chul Kim has authored 19 papers that have received a total of 343 indexed citations.
This includes 19 papers in Electrical and Electronic Engineering, 9 papers in Materials Chemistry and 9 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Electrodeposition and Electroless Coatings (18 papers), Copper Interconnects and Reliability (9 papers) and Corrosion Behavior and Inhibition (8 papers). Hoe Chul Kim is often cited by papers focused on Electrodeposition and Electroless Coatings (18 papers), Copper Interconnects and Reliability (9 papers) and Corrosion Behavior and Inhibition (8 papers) and collaborates with scholars based in South Korea and United States. Hoe Chul Kim's co-authors include Myung Jun Kim, Jae Jeong Kim, Seunghoe Choe, Taeho Lim and Soo‐Kil Kim and has published in prestigious journals such as Journal of The Electrochemical Society, Electrochimica Acta and Thin Solid Films
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