Myung Jun Kim
About
Myung Jun Kim has authored 96 papers that have received a total of 2.5k indexed citations.
This includes 81 papers in Electrical and Electronic Engineering, 47 papers in Electronic, Optical and Magnetic Materials and 42 papers in Materials Chemistry. The topics of these papers are Electrodeposition and Electroless Coatings (52 papers), Copper Interconnects and Reliability (39 papers) and Corrosion Behavior and Inhibition (21 papers). Myung Jun Kim is often cited by papers focused on Electrodeposition and Electroless Coatings (52 papers), Copper Interconnects and Reliability (39 papers) and Corrosion Behavior and Inhibition (21 papers) and collaborates with scholars based in South Korea, United States and France. Myung Jun Kim's co-authors include Jae Jeong Kim, Taeho Lim, Benjamin J. Wiley, Seunghoe Choe and Hoe Chul Kim and has published in prestigious journals such as Chemical Reviews, Journal of the American Chemical Society and ACS Nano
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