Ho‐Ming Tong
About
Ho‐Ming Tong has authored 19 papers that have received a total of 291 indexed citations.
This includes 11 papers in Electrical and Electronic Engineering, 6 papers in Biomedical Engineering and 6 papers in Mechanical Engineering. The topics of these papers are 3D IC and TSV technologies (7 papers), Electronic Packaging and Soldering Technologies (5 papers) and Epoxy Resin Curing Processes (3 papers). Ho‐Ming Tong is often cited by papers focused on 3D IC and TSV technologies (7 papers), Electronic Packaging and Soldering Technologies (5 papers) and Epoxy Resin Curing Processes (3 papers) and collaborates with scholars based in United States, Taiwan and Hong Kong. Ho‐Ming Tong's co-authors include Ching-Te Chuang, Jin‐Chern Chiou, Wei Hwang, Kuan‐Neng Chen and Po-Tsang Huang and has published in prestigious journals such as Water Research, IEEE Transactions on Electron Devices and Journal of Applied Polymer Science
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