Hua Lu

74 papers and 820 indexed citations i.

Hua Lu has authored 74 papers that have received a total of 820 indexed citations. This includes 54 papers in Electrical and Electronic Engineering, 23 papers in Mechanical Engineering and 20 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (44 papers), 3D IC and TSV technologies (18 papers) and Silicon Carbide Semiconductor Technologies (16 papers). Hua Lu is often cited by papers focused on Electronic Packaging and Soldering Technologies (44 papers), 3D IC and TSV technologies (18 papers) and Silicon Carbide Semiconductor Technologies (16 papers) and collaborates with scholars based in United Kingdom, Hong Kong and China. Hua Lu's co-authors include C. Bailey, M.J. Rizvi, Y.C. Chan, Y.C. Chan and Chunyan Yin and has published in prestigious journals such as Journal of Applied Mechanics, IEEE Transactions on Power Electronics and Journal of Alloys and Compounds