Hui Ren

30 papers and 1.1k indexed citations i.

Hui Ren has authored 30 papers that have received a total of 1.1k indexed citations. This includes 15 papers in Electrical and Electronic Engineering, 11 papers in Biomedical Engineering and 6 papers in Materials Chemistry. The topics of these papers are Electronic Packaging and Soldering Technologies (6 papers), Advanced Sensor and Energy Harvesting Materials (4 papers) and 3D IC and TSV technologies (4 papers). Hui Ren is often cited by papers focused on Electronic Packaging and Soldering Technologies (6 papers), Advanced Sensor and Energy Harvesting Materials (4 papers) and 3D IC and TSV technologies (4 papers) and collaborates with scholars based in China, Canada and United Kingdom. Hui Ren's co-authors include Guisheng Zou, Lei Liu, Qiang Jia, Wengan Wang and Bin Feng and has published in prestigious journals such as PLoS ONE, Analytical Chemistry and ACS Applied Materials & Interfaces