Huiqin Ling
About
Huiqin Ling has authored 45 papers that have received a total of 696 indexed citations.
This includes 37 papers in Electrical and Electronic Engineering, 21 papers in Materials Chemistry and 18 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Electrodeposition and Electroless Coatings (15 papers), Copper Interconnects and Reliability (13 papers) and Semiconductor materials and devices (11 papers). Huiqin Ling is often cited by papers focused on Electrodeposition and Electroless Coatings (15 papers), Copper Interconnects and Reliability (13 papers) and Semiconductor materials and devices (11 papers) and collaborates with scholars based in China, United States and Japan. Huiqin Ling's co-authors include Tao Hang, Anmin Hu, Yunwen Wu and Ming Li and has published in prestigious journals such as Applied Physics Letters, Journal of The Electrochemical Society and ACS Applied Materials & Interfaces
In The Last Decade
Explore authors with similar magnitude of impact
Top authors papers by Yunqing Li are co-authored with Top authors papers by Bo Hyun Lee are co-authored with Top fields papers by Bruno Polack are about Top authors papers by Antônio Ricardo de Toledo Gagliardi are co-authored with Top fields papers by Joseph Golden are about Top fields papers by Simon Weidert are about Top countries impacted by papers by A. Gobbetti Top authors papers by Joseph L. Rauh are co-authored with